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รายละเอียดสินค้า:
การชำระเงิน:
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| ชื่อผลิตภัณฑ์: | Gap Pad Filler ที่ใช้ซิลิโคน วัสดุ GAP PAD ความร้อนแบบอ่อนสำหรับโปรเซสเซอร์ AI เซิร์ฟเวอร์ AI โทรคมน | แอปพลิเคชัน: | โปรเซสเซอร์ AI, เซิร์ฟเวอร์ AI, บ้านอัจฉริยะ, โทรคมนาคม |
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| อุณหภูมิในการทำงานที่แนะนำ: | -40 ถึง 200 ℃ | การนำความร้อน: | 5.0W/m-K |
| ความแข็ง: | 65/20 ฝั่ง 00 | ความหนาแน่น: | 3.2 ก./ลบ.ซม |
| สี: | สีเทาเข้ม | ความหนา: | 0.010"(0.25มม.)~0.200"(5.0มม.) |
| คำหลัก: | แผ่นช่องว่างความร้อน |
Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom
The TIF®100-50-11US Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.
Features
> Good thermal conductive: 5.0W/mK
> Moldability for complex parts
> Easy release construction
> Electrically isolating
> High durability
Applications
Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.
| Typical Properties of TIF®100-50-11US Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.2 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @ 1MHz | 6.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0W/m-K | ASTM D5470 | |
| 5.0W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.
Company profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
ผู้ติดต่อ: Dana Dai
โทร: 18153789196
