ZIITEK TIG7835N Liquid Metal | Thermal Interface Filler Material, for Heat Dissipation in Consumer Electronics, Achieving Unmatched Performance without Overheating

ZIITEK TIG7835N liquid metal, 35W ultra-high thermal conductivity cutting-edge technology, liquid at room temperature, low surface tension, completely fills the gap between the chip and the heat sink, zero air thermal resistance, heat is instantly transferred without accumulation.

✅ Core advantage: Robust heat dissipation
35W/m·K ultra-high thermal conductivity: Far exceeding traditional silicone pastes, it enables rapid heat dissipation for high-power chips, eliminating the problem of high temperatures.
Room-temperature liquid + low surface tension: No heating required, perfectly fits tiny gaps, maximum heat dissipation efficiency
Long-lasting stability and non-evaporation: Non-drying, non-leaking, non-corrosive, with zero performance degradation over a long period of use.
Safety and Environmental Protection: Non-toxic and non-irritating, compliant with RoHS standards, suitable for demanding electronic environments

✅ Full-scenario coverage, one device handles microprocessors, AI chips, graphics processing chips, set-top boxes, LED TVs/lights, laptops, liquid cooling...

From consumer electronics to industrial equipment, efficient heat dissipation in all scenarios.