Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe TIF®030-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent ... อ่านเพิ่มเติม
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... อ่านเพิ่มเติม
3mm Thickness Thermal Pad Silicone Laptop Die Cuts High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad The TIF7120RUS is recommended for applications that require a minimum amount of ... อ่านเพิ่มเติม
Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components ... อ่านเพิ่มเติม
High Performance 1.6W/mK Aluminum Foil Double Sided Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA® 800AL Series is widely used for bonding heat sinks to microprocessors and other power ... อ่านเพิ่มเติม
Outgasing 0.35% UL recognized Conductive Pads for Micro Heat Pipe Thermal Solutions The TIF1160-05UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ... อ่านเพิ่มเติม
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... อ่านเพิ่มเติม
IGBTs Thermal Conductive Pad Designed For Filling Air Gaps Between Heating Elements And Metal Bases To Improve Heat Dissipation Product introduction The TIF® 100-20-18S Series thermally conductive interface ... อ่านเพิ่มเติม