Thermal Gap Filler Combining Flexibility, Elasticity and High Thermal Conductivity Product Overview The TIF® 200-30-12S Series is a compound thermal interface material that combines excellent thermal conductivi... อ่านเพิ่มเติม
TIC806A Gray 2.5 W/MK Low Melting Point Re-Flow Compatible Phase Changing Materials For High Frequency Microprocessors Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, ... อ่านเพิ่มเติม
Cache Chips Gray 2.5 W/MK Heat Sink Cooling Phase Changing Materials The TIC®800A series is a high-performance,cost-effective thermal interface material featuring a unique grain-oriented structure that enables ... อ่านเพิ่มเติม
Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems Products description TIF® 100-20-10S Series is a well-balanced,general-purpose thermal ... อ่านเพิ่มเติม
Excellent Thermal Conductivity Thermal Conductive Phase Change Material For Server CPU The TIC® 800H Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. ... อ่านเพิ่มเติม
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets The TIC® 800T Series is an ultra-high thermal conductivity phase change material with a ... อ่านเพิ่มเติม